Module 12 Project

Capstone Bridge / Mini-Project

Everything from Modules 01–11 comes together here in one design exercise — then hands off to the site's existing DDR4 SI verification capstone, which picks up exactly where this course leaves off.

Where this capstone sits

Select components
Design (this course)
Route the board
Verify (SI capstone)
Bring-up

This mini-project asks you to make and justify the same decisions a real design would require, using Modules 01–11 as your reference. It ends with a bridge into the DDR4 SI verification capstone, which assumes an interface like the one you just designed and walks through post-layout simulation, eye-diagram analysis, and sign-off.

Mini-project brief

Scenario: you're designing a DDR4-2400 interface between a mid-range FPGA (hardened memory PHY) and a single-rank, x16, discrete DDR4 DRAM, targeting an embedded vision/compute board. Work through the tasks below in order — each one leans directly on a specific module.

1. Component selection (Module 02): List the datasheet sections you'd pull first for this part, and state which FPGA memory-controller specs you must cross-check before locking the part number.
2. Key parameters (Module 03): Identify tCK, CL, tRCD, and tRP for DDR4-2400 from a JEDEC-style speed bin table, and convert CL from a cycle count to nanoseconds.
3. Topology (Module 04): Choose and justify the topology for the CA/CK bus and for the DQ/DQS byte lanes on a single-rank, single-device interface.
4. Signal groups (Module 05): For a x16 device, state how many byte lanes exist and list every signal that belongs to one byte lane.
5. Termination (Module 07): Specify where VTT termination is required, and which DDR4 ODT mode you'd select for idle vs. write conditions.
6. Decoupling (Module 08): Propose a three-tier decoupling stack (bulk / mid MLCC / high-frequency MLCC) with approximate values and placement priorities.
7. Routing (Module 09): State the length-matching tolerance hierarchy you'd apply, from tightest to loosest.
8. FPGA-specific (Module 10): Identify which pins in your byte lane are freely swappable and which are fixed.
Reveal self-check answer key
Task Expected answer
1 Timing table, electrical characteristics, IDD current tables, package/ball map; cross-check FPGA controller's max supported speed grade and DCI/OCT support.
2 DDR4-2400: tCK ≈ 0.833 ns; typical CL17 → tRCD/tRP ≈ 13.32 ns ÷ 0.833 ns ≈ 16 cycles.
3 Fly-by, daisy-chained in device order, for CA/CK/control; point-to-point per byte lane for DQ/DQS (single device, so trivially point-to-point).
4 Two byte lanes (x16 = 2 × x8); each lane = DQ[7:0] + DQS/DQS# + DM/DBI.
5 VTT termination at the true end of the CA fly-by bus; RTT_NOM enabled at idle, RTT_WR (or off) during writes, per datasheet defaults.
6 Bulk (~100–220 µF) near the regulator; 1 µF mid MLCC ringing FPGA/DRAM power pins; 0.1/0.01 µF MLCC as close to each power ball as possible.
7 DQS+/DQS− tightest, then DQ/DM to DQS within a lane, then byte-lane-to-byte-lane, then CA/CK looser but still bounded.
8 DQ bits within the lane are freely swappable; DQS and CK pins are fixed to the hardened PHY lane.

Next: verify what you just designed

This course stops at a routed board. The natural next step is verification — taking that routed interface through post-layout simulation, checking eye diagrams against the JEDEC mask, and producing a sign-off report before bring-up. That's exactly what the site's existing DDR4 SI capstone covers.

DDR4 SI Verification Capstone → Post-layout simulation, eye-diagram analysis, and sign-off for a DDR4 interface — picks up immediately after this course's routing stage.

Keep exploring

I2C Interface Academy → Another shared-bus interface with its own topology and signal-integrity trade-offs.
FPGA Fundamentals & Architecture → For a deeper look at the FPGA fabric and I/O resources referenced in Module 10.
Signal Integrity Academy → Broader SI fundamentals beyond the DDR4-specific treatment in Module 06.