Module 12 Project

Capstone Bridge / Mini-Project

Everything from Modules 01–11 comes together here in one design exercise — then hands off to the site's existing DDR4 SI verification capstone, which picks up exactly where this course leaves off.

Where this capstone sits

Select components
→
Design (this course)
→
Route the board
→
Verify (SI capstone)
→
Bring-up

This mini-project asks you to make and justify the same decisions a real design would require, using Modules 01–11 as your reference. It ends with a bridge into the DDR4 SI verification capstone, which assumes an interface like the one you just designed and walks through post-layout simulation, eye-diagram analysis, and sign-off.

Mini-project brief

Scenario: you're designing a DDR4-2400 interface between a mid-range FPGA (hardened memory PHY) and a single-rank, x16, discrete DDR4 DRAM, targeting an embedded vision/compute board. Work through the tasks below in order — each one leans directly on a specific module.

1. Component selection (Module 02): List the datasheet sections you'd pull first for this part, and state which FPGA memory-controller specs you must cross-check before locking the part number.
2. Key parameters (Module 03): Identify tCK, CL, tRCD, and tRP for DDR4-2400 from a JEDEC-style speed bin table, and convert CL from a cycle count to nanoseconds.
3. Topology (Module 04): Choose and justify the topology for the CA/CK bus and for the DQ/DQS byte lanes on a single-rank, single-device interface.
4. Signal groups (Module 05): For a x16 device, state how many byte lanes exist and list every signal that belongs to one byte lane.
5. Termination (Module 07): Specify where VTT termination is required, and which DDR4 ODT mode you'd select for idle vs. write conditions.
6. Decoupling (Module 08): Propose a three-tier decoupling stack (bulk / mid MLCC / high-frequency MLCC) with approximate values and placement priorities.
7. Routing (Module 09): State the length-matching tolerance hierarchy you'd apply, from tightest to loosest.
8. FPGA-specific (Module 10): Identify which pins in your byte lane are freely swappable and which are fixed.
Reveal self-check answer key
Task Expected answer
1 Timing table, electrical characteristics, IDD current tables, package/ball map; cross-check FPGA controller's max supported speed grade and DCI/OCT support.
2 DDR4-2400: tCK ≈ 0.833 ns; typical CL17 → tRCD/tRP ≈ 13.32 ns ÷ 0.833 ns ≈ 16 cycles.
3 Fly-by, daisy-chained in device order, for CA/CK/control; point-to-point per byte lane for DQ/DQS (single device, so trivially point-to-point).
4 Two byte lanes (x16 = 2 × x8); each lane = DQ[7:0] + DQS/DQS# + DM/DBI.
5 VTT termination at the true end of the CA fly-by bus; RTT_NOM enabled at idle, RTT_WR (or off) during writes, per datasheet defaults.
6 Bulk (~100–220 µF) near the regulator; 1 µF mid MLCC ringing FPGA/DRAM power pins; 0.1/0.01 µF MLCC as close to each power ball as possible.
7 DQS+/DQS− tightest, then DQ/DM to DQS within a lane, then byte-lane-to-byte-lane, then CA/CK looser but still bounded.
8 DQ bits within the lane are freely swappable; DQS and CK pins are fixed to the hardened PHY lane.

Next: verify what you just designed

This course stops at a routed board. The natural next step is verification — taking that routed interface through post-layout simulation, checking eye diagrams against the JEDEC mask, and producing a sign-off report before bring-up. That's exactly what the site's existing DDR4 SI capstone covers.

DDR4 SI Verification Capstone → Post-layout simulation, eye-diagram analysis, and sign-off for a DDR4 interface — picks up immediately after this course's routing stage.

Keep exploring

I2C Interface Academy → Another shared-bus interface with its own topology and signal-integrity trade-offs.
FPGA Fundamentals & Architecture → For a deeper look at the FPGA fabric and I/O resources referenced in Module 10.
Signal Integrity Academy → Broader SI fundamentals beyond the DDR4-specific treatment in Module 06.