Lesson 3/1718%
MODULE 03

Optocoupler Construction

How optocouplers are physically built: die technologies for emitter and detector, co-planar vs stacked die arrangements, isolation barrier materials and their partial-discharge behavior, package families from 4-pin DIP to wide-body SO16, and a walk through the manufacturing and test flow.

⏳ Coming Soon — content in development

Learning Objectives

After completing this module, you will be able to:

Describe LED and detector die technologies and their trade-offs
Compare co-planar, stacked, and reflective coupling constructions
Evaluate isolation barrier materials (polyimide, silicone, epoxy)
Select package types for creepage, clearance, and assembly requirements
Outline the manufacturing and production-test sequence

Planned Topics

Internal structure variants
LED technologies (GaAs, GaAlAs)
Detector technologies
Package types and dimensions
Isolation barrier materials
Manufacturing overview

Reserved Sections

This module will follow the same interactive format as Module 1:

Interactive animations

Animated diagrams and simulations for this module are in development.

Engineering calculators

Module-specific design calculators will appear here.

Design examples

Worked examples with full component values are planned for this section.

Knowledge check

Multiple-choice, true/false, and scenario exercises will be added.

Downloadable resources

PDF notes, reference tables, and checklists will be provided.

While you wait: Module 1 — Introduction to Optocouplers — is fully available, including animations, the CTR and isolation calculators, and a complete knowledge check. Start there →