Lesson 8/1080%
MODULE 08

TVS Protection & PCB Layout Best Practices

The best ESD test result comes from a design that never lets the transient reach a sensitive pin in the first place: the right TVS diode, placed and routed correctly, stops most of the current before it ever gets close.

Learning Objectives

🛡
Select a TVS diode by working and clamp voltage
📐
Apply PCB layout rules that keep transients off sensitive traces
🔌
Apply grounding and shielding practices

A TVS (transient voltage suppressor) diode must satisfy two conditions simultaneously: its working voltage (VRWM) must sit above your signal's normal operating range so it stays off during normal operation, and its clamp voltage (VC) at the expected ESD current must sit below the maximum voltage rating of the IC it protects.

Try It: TVS Clamping Window

5.0 V
7.0 V
5.5 V

Animated: Discharge Path Comparison

Rule Why it matters
Place TVS as close as possible to the connector/entry point Minimizes the trace length carrying the raw transient before it is clamped
Route TVS ground return with a short, low-inductance path to chassis/earth A long or high-inductance ground path lets voltage build across it during the fast current pulse, reducing effective clamping
Keep sensitive signal traces away from connector edges and seams Reduces direct or capacitively-coupled exposure to an air-discharge event near the enclosure opening
Use a continuous ground plane under high-speed and I/O traces Provides a low-impedance return path and reduces loop area for coupled transients
Add a moat or slot only with a deliberate single-point stitching strategy An unintentional ground-plane split can force return current through a much longer, higher-impedance path
PCB (signal GND plane) I/O single star point current stays on chassis

Star-point chassis ground. Chassis grounded to PCB ground at a single, low-impedance connection near the connector entry -- ESD current stays on the enclosure instead of crossing the signal ground plane.

seam gasket / spring fingers electronics stay quiet

Bridge every seam. Conductive gaskets or spring fingers keep the enclosure electrically continuous, so an air discharge at a seam spreads along the shield instead of finding a high-impedance path inside.

enclosure wall ferrite / CM choke fast transient attenuated

Choke the cables. Ferrite beads or common-mode chokes at the cable entry add high-frequency impedance in the ESD current's path without disturbing the intended low-frequency signal.

conn. IC pin series R TVS small residue

Two-stage clamp at exposed I/O. A TVS at the connector takes the bulk current; a small series resistor (or ESD-rated connector) after it drops the residual before the IC pin.

Every protection-part selection is the same seven questions asked in the same order. Work through them once for each externally exposed interface on your product, and the datasheet parameters you need fall out automatically.

Rule of thumb for step 4: an IEC 61000-4-2 discharge peaks at roughly 3.75 A per kV of test voltage (8 kV → ~30 A first peak). The voltage your IC actually sees is VC ≈ VBR + Rdyn × Ipeak — so a TVS with 1 Ω dynamic resistance adds ~30 V at 8 kV. Low Rdyn matters as much as the headline clamp figure.

Worked Examples: Pick Your Interface

The same seven steps applied to six common interfaces. Values are typical starting points — always verify against your product's governing standard and the protected IC's datasheet.

KNOWLEDGE CHECK

Module 8 Quiz

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