Final Design Review & Validation

Thermal Performance

• Junction temperature below maximum with safety margin (≥10°C)
• Thermal resistance chain verified (R_JC + R_CS + R_SA)
• Worst-case ambient temperature considered
• Power dissipation includes design margin (10-20%)
• Sensitivity analysis performed (power, ambient, airflow)

Reliability

• Component derating applied (T_J at 80% of max)
• TIM long-term reliability verified (no pump-out, dry-out)
• Fan MTTF acceptable for application (if used)
• Thermal cycling effects considered
• No single-point thermal failures

Manufacturability

• Heatsink commercially available or standard tooling
• Assembly process defined (TIM application, mounting)
• Mounting hardware specified (clips, screws, adhesive)
• Torque specifications defined
• Rework procedure documented

Mechanical & Environmental

• Weight within PCB and system constraints
• Height within enclosure clearance
• Vibration and shock retention verified
• Dust/contamination effects on fin spacing considered
• Galvanic corrosion prevented (dissimilar metals)

Cost & Supply Chain

• BOM cost within target
• Second source available for heatsink
• Lead time acceptable for production schedule
• Volume pricing negotiated