Lesson 12/1392%
CAPSTONE PROJECT 2

Power Supply Heat Sink Design

Design thermal management for a 500 W half-bridge DC-DC converter with high-side and low-side MOSFETs. Compare natural convection and forced-air cooling approaches and select the production solution.

Project Overview

Application: 500 W Half-Bridge DC-DC Converter (48V → 12V)
Target Device: Infineon IPP110N20N3 (N-Channel MOSFET, TO-220)
Total MOSFET Loss: 18 W per device (2 devices = 36 W total)
Switching Frequency: 100 kHz
Ambient Temperature
50°C (worst case)
Maximum Junction
150°C (derated from 175°C)
Package
TO-220-3
RθJC
0.7 °C/W
RθCS
0.5 °C/W (with insulator)
Mounting
Screw + thermal pad

For a power MOSFET in a switching converter, total loss = conduction loss + switching loss:

Pcond = IRMS2 × RDS(on)
Psw = 0.5 × VDS × ID × (tr + tf) × fsw
Reading the MOSFET Datasheet for Thermal Parameters: key sections in the Infineon IPP110N20N3 datasheet: Page 1 Key Parameters (RDS(on) = 11 mΩ, VDS = 200V, ID = 88A); Thermal Characteristics Table (RθJC = 0.7 °C/W, RθJA = 62 °C/W); SOA diagram for safe operating area limits; transient thermal impedance ZθJC(t) curves for pulsed operation. The TO-220 package mounts directly to a heatsink via the metal tab (drain connection) — an electrical insulator (mica washer or silicone pad) is required for non-isolated mounting.

MOSFET Power Loss Calculator

Conduction Loss (Pcond)
Switching Loss (Psw)
Total Loss per MOSFET

Heatsink Requirement Calculator

Thermal Budget (TJ - TA)
ΔT used by RθJC (per device)
ΔT used by RθCS (per device)
Available ΔT for heatsink
Total power to heatsink
Required RθSA
Important: When multiple devices share a heatsink, the total power is the sum of all devices, but RθJC and RθCS apply per device. The heatsink must handle the total heat from all devices.

Required RθSA vs. Power per Device

Natural Convection Heatsink Sizing

Optimal Fin Spacing
Number of Fins
Total Surface Area
Estimated RθSA
Meets Requirement?
Challenge: With 36 W total and natural convection only, achieving RθSA < 2 °C/W requires a large heatsink (typically >150 cm² surface area in vertical orientation). This may exceed available board space.

Natural Convection: RθSA vs. Fin Height

Adding a fan dramatically reduces thermal resistance. Adjust air velocity and heatsink size to compare natural vs. forced convection performance.

Fan-Cooled Performance

Air Velocity2.0 m/s
Estimated RθSA
Predicted TJ
Temperature Margin
Improvement vs Natural

Natural vs Forced Convection Comparison

Natural Convection
RθSA ≈ 2.5–4 °C/W · Requires large heatsink (100×100×50mm) · Silent, no moving parts · May not meet thermal requirement
Forced Convection (2 m/s)
RθSA ≈ 0.8–1.5 °C/W · Compact heatsink (80×80×35mm) · Fan noise ~25-35 dBA · Easily meets thermal requirement ✓

Automated Design Review Checklist

Thermal Performance: TJ < TJ,max with ≥20°C margin
Reliability: MTTF > 100,000 hours at operating temperature
Manufacturability: Standard TO-220 mounting, commercially available heatsink
Cost: Aluminum extrusion + standard fan within BOM target
Weight: Total heatsink assembly < 300g
Mechanical: Screw mounting with proper torque (0.5 N·m)
Electrical Isolation: Insulator pad rated for VDS voltage + margin
Vibration: Verify heatsink retention under shock/vibration (if applicable)
Dust: Evaluate fin spacing for dust accumulation in operating environment

Final Design Summary

══════════════════════════════════════════════════════ POWER SUPPLY HEAT SINK DESIGN REPORT Capstone Project 2 — Rising Edge Training ════════════════════════════════════════════════════ ── APPLICATION ── Converter: 500W Half-Bridge DC-DC (48V → 12V) Topology: Synchronous buck with half-bridge Devices: 2× Infineon IPP110N20N3 (TO-220) Total Loss: 36W (18W × 2 devices) ── THERMAL PARAMETERS ── R_θJC: 0.7 °C/W (per device) R_θCS: 0.5 °C/W (with silicone insulator) T_J,max: 150°C (derated from 175°C) T_ambient: 50°C Required R_θSA: 1.94 °C/W ── NATURAL CONVECTION ANALYSIS ── Required Heatsink: 100×100×50mm (vertical orientation) Estimated R_θSA: 2.5 °C/W Status: ✗ INSUFFICIENT (T_J = 158°C exceeds limit) ── FORCED CONVECTION SOLUTION (RECOMMENDED) ── Heatsink: 80×80×35mm extruded aluminum Material: Aluminum 6063-T5, black anodized Fan: 60mm axial, 3000 RPM, 15 CFM Air Velocity: ~2 m/s across fins Achieved R_θSA: 1.1 °C/W Predicted T_J: 93.6°C Margin: 56.4°C below maximum ✓ ── MOUNTING DETAILS ── Attachment: M3 screws with spring washers Torque: 0.5 N·m TIM: Silicone insulator pad (0.5 °C/W) Electrical: 2.5kV isolation rating ── STATUS: PASS (Forced Convection) ── ════════════════════════════════════════════════════